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Kalite AX7900 25 Derece Devirme Elektronik X Ray Makinesi BGA CSP Flip Chip Muayenesi için fabrika

AX7900 25 Derece Devirme Elektronik X Ray Makinesi BGA CSP Flip Chip Muayenesi için

AX7900 with function of tilting ±25° for better inspection effect Description of IC X Ray machine AX7900: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading area 420mm

Kalite IC ve BGA Lehimleme Topları için 90kV Off-Line PCB X-Ray Makinesi Unicomp AX7900 fabrika

IC ve BGA Lehimleme Topları için 90kV Off-Line PCB X-Ray Makinesi Unicomp AX7900

5 micron focus spot closed type tube X-Ray machine Unicomp AX7900 for SMT BGA QFN IC inspection Description of IC Xray machine AX7900: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection

Kalite 80KV/90KV Elektronik X Ray Makinesi Çip İç Kusurları Denetimi İçin Tam Yerleşim Lazer Bulandırıcı fabrika

80KV/90KV Elektronik X Ray Makinesi Çip İç Kusurları Denetimi İçin Tam Yerleşim Lazer Bulandırıcı

Wire Harness Quality Detection AX7900 Electronics Unicomp X Ray Equipment Description of IC X-Ray machine AX7900: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading

Kalite PCBA BGA QFN LED lehimleme boşluğunu incelemek için FPD 55° eğimli görünüme sahip 5μm Mikrofokus X-ray fabrika

PCBA BGA QFN LED lehimleme boşluğunu incelemek için FPD 55° eğimli görünüme sahip 5μm Mikrofokus X-ray

5μm Microfocus X-ray with FPD 55° tilting view to inspect PCBA BGA QFN LED soldering void Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD) Pixel

Kalite Bağlayıcı için 1.6kW Çevrimdışı Programlama Unicomp X Ray AX9100 fabrika

Bağlayıcı için 1.6kW Çevrimdışı Programlama Unicomp X Ray AX9100

CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Offline programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ●

Kalite SMT BGA CSP için 3um Kapalı Tüp 1.6kW X Ray Makinesi fabrika

SMT BGA CSP için 3um Kapalı Tüp 1.6kW X Ray Makinesi

CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor,

Kalite FPC SMT Lehimleme İçin Programlanabilir BGA QFN CSP X Ray Ekipmanı LX2000 CNC fabrika

FPC SMT Lehimleme İçin Programlanabilir BGA QFN CSP X Ray Ekipmanı LX2000 CNC

LX2000 inline x-ray equipment with CNC programmable inspection for FPC SMT soldering process of BGA , QFN, CSP parts Technical Parameters and Specifications System Summary Footprint 2595(W)×1392(D)×1992(H)mm Machine Weight 1900 kg (X-Ray) / 700kg (Conveyor) Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 180(W)×170(D)×190(H)cm (X-Ray) 150(W)×105(D)×120(H)cm (Conveyor) Packing Weight 2000kg (X-Ray) / 800kg (Conveyor) Power Consumption 3.5 kW X-Ray Tube Tube Type Sealed

Kalite 100KV Yarı İletken için CSP LED X Ray Makinesi Kapalı Tüp Flip Chip AX8500 fabrika

100KV Yarı İletken için CSP LED X Ray Makinesi Kapalı Tüp Flip Chip AX8500

Closed Tube Type AX8500 X Ray Machine for semiconductor Lead frame wiring bonding quality inspection Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector

Kalite CX3000 Elektronik PCBA Unicomp X Ray Algılama Makinesi, Masa Üstü X Ray Makinesi fabrika

CX3000 Elektronik PCBA Unicomp X Ray Algılama Makinesi, Masa Üstü X Ray Makinesi

CX3000 Benchtop Electronics PCBA Unicomp X-ray Detection Equipment Features: 1. 5μm 100kV X-ray tube; 2. Dynamic FPD with high-resolution of 1000×1124; 3. Equipped with 360° rotary fixture to eliminate PoP shadow; 4. The detection area easily positioned by external rocker; 5. Inspection & Analysis of soldering joint and materials inner structure; 6. High safety with seamless lead welding, interlock and emergency button. Applications: BGA , CSP , LED , Flip Chip , Semiconducto