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Elektronik X Ray Makinesi

Kalite PCBA BGA QFN LED lehimleme boşluğunu incelemek için FPD 55° eğimli görünüme sahip 5μm Mikrofokus X-ray fabrika

PCBA BGA QFN LED lehimleme boşluğunu incelemek için FPD 55° eğimli görünüme sahip 5μm Mikrofokus X-ray

5μm Microfocus X-ray with FPD 55° tilting view to inspect PCBA BGA QFN LED soldering void Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD) Pixel
Kalite Unicomp AX8500 110kV 5um 2.5D Elektronik için X-ray SMT PCBA BGA IC lehimleme kalite kontrolü fabrika

Unicomp AX8500 110kV 5um 2.5D Elektronik için X-ray SMT PCBA BGA IC lehimleme kalite kontrolü

Unicomp AX8500 110kV 5um 2.5D X-ray for Electronics SMT PCBA BGA IC soldering quality check Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD)
Kalite Giyilebilir Elektronikler şarj edilebilir Lityum düğme hücresini incelemek için 5μm yakın tüplü X-ray uygulama fabrika

Giyilebilir Elektronikler şarj edilebilir Lityum düğme hücresini incelemek için 5μm yakın tüplü X-ray uygulama

Applying 5μm close tube X-ray to inspect Wearable Electronics rechargeable Lithium button cell Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging
Kalite % 99.8 Acurracy X Ray Tarama Makinesi Chip Sayacı MES ERP Sistemine Yükle fabrika

% 99.8 Acurracy X Ray Tarama Makinesi Chip Sayacı MES ERP Sistemine Yükle

Unicomp online X-Ray Chip Counter System, Counting Result Automatic upload to MES ERP System Spcifications: Max.Voltage 100kV Max.Current 3.5mA Spot Size 0.4mm Working Method Automatic inline inspection Imaging system Line scan camera Scanning accuracy >99.8% Scanning size 450 X 80 mm Minimum material size 01005 Display 22'LCD Display Max. inspection speed 0.1m/s Inspection size Φ30-Φ450mm less than 50mm thickness tray Scan height 10mm-60mm Dimensions 5500mm X 1000mm X 2100
Kalite Kabin Unicomp X-Ray Cihazları 220AC / 50Hz DXI Görüntü İşleme Sistemi ile fabrika

Kabin Unicomp X-Ray Cihazları 220AC / 50Hz DXI Görüntü İşleme Sistemi ile

EMS Semiconductor Unicomp X-Ray Inspection System Electronics BGA AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework
Kalite Elektronik ve Yarıiletken için Yüksek Esnek X-Ray Muayene Ekipmanları fabrika

Elektronik ve Yarıiletken için Yüksek Esnek X-Ray Muayene Ekipmanları

Highly flexible and cost effective electronics and semiconductor X Ray Machine X-ray detection technology for the SMT production testing means brought new changes, it can be said that it is the desire to further improve the level of production technology to improve the quality of production, and will soon find the circuit assembly failure as a breakthrough. It's the best selection for the manufacturer. X-ray Inspecting Features: (1) Coverage of process defects up to 97%.
Kalite BGA ve CSP incelemesi için EMS Yarıiletken Elektroniği X Ray Makinesi Sistemi fabrika

BGA ve CSP incelemesi için EMS Yarıiletken Elektroniği X Ray Makinesi Sistemi

EMS Semiconductor Electronics X Ray Machine System for BGA and CSP inspection The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework
Kalite Unicomp Elektronik X Ray Makinesi Ekstra Büyük Muayene Alanı Ve Bol Güç fabrika

Unicomp Elektronik X Ray Makinesi Ekstra Büyük Muayene Alanı Ve Bol Güç

Electronics X Ray Machine Extra large inspection area and plenty of power​ X-ray inspection system has been widely applied to Circuit Board Inspection,Semi-Conductor Inspection and Other Applications. (Offline X - Ray series) widely used in offline detection, defect analysis, used for PCBA, packaging, ceramics, plastics, LED, and so on. OUR SERVICE 1. Your inquiry will be replied in 12 hours. 2. Original Manufacture to customers, with competitive price. 3. We provide one year
Kalite AC 110-220V Elektronik X Ray Makinesi Çok Amaçlı Sistem, Flip Chip, COB için fabrika

AC 110-220V Elektronik X Ray Makinesi Çok Amaçlı Sistem, Flip Chip, COB için

Electronics X Ray Machine for BGA , CSP , LED , Flip Chip , Semiconductor OUR SERVICE 1. Your inquiry will be replied in 12 hours. 2. Original Manufacture to customers, with competitive price. 3. We provide one year warranty, free training and whole life technology support. 4. We can arrange the shipment by air, DHL,Fedex, UPS, and by Sea,etc for you, and will give you the tracking NO. after shipment. 5. Well-trained and Professional after-sales service team to support you. 6