pcb inspection system
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CNC Programlanabilir Muayene için Unicomp AX8200Max X Ray Makinesi 6 Eksen Manipülatörü
Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1.Large Size Inspection Table Laser Locator for Precise Location 2.24’’ FHD Interactive Touch LCD Display 3.Accurate Control, CNC Programming Automatic Positioning 4.FPD 60° Tilting Inspection 5.Fingerprint Access Management System 6
CNC Haritalama ile CSP LED 5um X Ray Muayene Makinesi Mikrofokus AX8200
Unicomp 5um Microfocus AX8200 X Ray Inspection Machine For Automotive Electronics quality control with CNC mapping Applications: BGA , CSP , LED , Flip Chip , Semiconductor, Battery Industry , Small Metal Casting, Electronic Connector Module, Aerospace Components , Photovoltaic Industry, The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB
Unicomp Lityum Pil X Ray Denetim Makinesi Yüksek Çözünürlük AX8200B 130kV Kapalı Mikron tüpü
Unicomp 5um 90kV sealed tube X-Ray Inspection Machine AX8200B for button Lithium battery inspection Applications: BGA , CSP , LED , Flip Chip , Semiconductor, Battery Industry , Small Metal Casting, Electronic Connector Module, Aerospace Components , Photovoltaic Industry, The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process
R2R etkinleştirilmiş CX3000 Masaüstü X-ışını sistemi doğru PCBA denetimi ve SMT uygulamaları için
Brand New Generation of CX3000 with Reel to Reel Function Making It More Competitive FEATURES of Desktop X-ray machine 1. 5μm 100kV X-ray tube; 2. Dynamic FPD with a high resolution of 1000×1124; 3. Equipped with 360° rotary fixture to eliminate PoP shadow; 4. The detection area is easily positioned by an external rocker; 5. Inspection & Analysis of soldering joint and materials inner structure; 6. High safety with seamless lead welding, interlock, and emergency button.
Unicomp AX7900 Yüksek Spesifikasyonlar 2D 2.5D Cep Telefonları Denetimi ve Çatlak Kontrolü için X-Ray Makinesi
High specifications electronic boards 2D & 2.5D X-ray machine Unicomp AX7900 for used cellphone quality inspection and cracks checking Description of IC X Ray machine AX7900: It is widely used in various fields, including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Production, small-scale metal casting, electronic connector modules, cables, aerospace components, as well as the photovoltaic industry, among others. FEATURES of IC Xray machine AX7900: A
Unicomp AX9100max X-ray Machine High-Performance for IGBT Inspection in Various Industries
Unicomp AX9100max X-ray Machine High-Performance for IGBT Inspection in Various Industries Unicomp AX9100max X-ray Machine 130kV 65W FOR BGA Unicomp AX9100max X-ray Machine The AX9100max is a high-performance X-ray inspection system specially designed for IGBT inspection and other advanced applications. It is widely used across multiple industries, including: Semiconductors: BGA, CSP, Flip Chip, Diode, IGBT Electronics: LED, PCB, Fuse, Connector Modules, Cables Energy & Power
Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis
Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis The Unicomp AX9100max X-ray Inspection System is engineered specifically for IGBT module analysis and serves a broad range of industries, including: BGA/CSP/Flip Chip packaging LED & optoelectronic components Fuse & diode manufacturing PCB & semiconductor assembly Battery production Small metal castings Electronic connector modules & cables Photovoltaic (PV) cell inspection Application
PCBA Muayene için Finefocus Tüpü 100KV X Ray Tarayıcı AX8200
X-Ray Inspection Machine Electronics BGA Standard Multifunction Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. Applications:BGA , CSP , LED , Flip Chip , Semiconductor,Battery Industry , Small Metal Casting,Electronic Connector Module,Aerospace Components , Photovoltaic Industry,Other Special Industries. Technical Data
Elektronik Bileşenlerin iç kusurlarını incelemek için Unicomp AX9100max X-ışını sistemi
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 3.5 kW X-Ray Tube Tube Type Type Sealed type Max.
