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Unicomp AX8300MAX 110KV X-ray Inspection for BGA One-Click Automated Void Detection

Temel Özellikler
Menşe Yeri: Çin
Marka Adı: UNICOMP
Sertifikasyon: CE, FDA
Model Numarası: AX8300MAX
Ticaret Mülkleri
Minimum Sipariş Miktarı: 1 takım
Fiyat: can negotiate
Ödeme Koşulları: T/T,L/C
Tedarik Yeteneği: Aylık 30 Takım
Ürün Özetleri
Unicomp AX8300MAX 110KV X-ray Inspection System Advanced X-ray inspection system with Unicomp Auto Void Analysis for comprehensive semiconductor and electronics testing. Features 60° tilt and 360° rotary stage for BGA and HIP (Head-In-Pillow) inspection. Applications This system is widely applicable ...

Ürün Detayları

Vurgulamak:

Unicomp AX8300MAX X-ray inspection machine

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BGA automated void detection X-ray

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110KV X-ray machine for electronics

Motion Control Mode: Fare ve Klavye ve Oyun Çubuğu
Tilt And Rotation: Dedektörün tek taraflı eğimi maksimum 60°
Monitor: 27" HD 4K ekran
System OS: Windows11 64 bit
Power Consumption: 900W
Ürün Açıklaması
Unicomp AX8300MAX 110KV X-ray Inspection System Advanced X-ray inspection system with Unicomp Auto Void Analysis for comprehensive semiconductor and electronics testing. Features 60° tilt and 360° rotary stage for BGA and HIP (Head-In-Pillow) inspection. Applications This system is widely applicable to semiconductor packaging (BGA, CSP, LED, Flip Chip), automotive parts, new energy industry components, aluminum die castings, injection molded plastics, ceramic products and
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