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High‑definition FPD Detector BGA Head‑In‑Pillow Defect AX9500 Unicomp SMT Welding Analysis System

Temel Özellikler
Menşe Yeri: Çin
Marka Adı: UNICOMP
Sertifikasyon: CE, FDA
Model Numarası: AX9500
Ticaret Mülkleri
Minimum Sipariş Miktarı: 1 takım
Fiyat: can negotiate
Ödeme Koşulları: T/T,L/C
Tedarik Yeteneği: Ayda 300 Takım
Ürün Özetleri
High-definition FPD Detector BGA Head-In-Pillow Defect AX9500 Unicomp SMT Welding Analysis System The AX9500 UNICOMP X-Ray Computed Tomography System delivers high-precision CT inspection for accurate PCB and BGA analysis. This fully upgraded system performs comprehensive CT detection on BGA, CSP, ...

Ürün Detayları

Vurgulamak:

FPD detector BGA defect analysis

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Unicomp SMT welding system

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X-ray head-in-pillow inspection

Name: Unicomp X-ray Muayene Makinesi
Application: SMT, EMS, BGA, Elektronik, CSP, LED, Flip Chip, Yarı İletken
Industry: Elektronik endüstrisi
X-Ray Leakage: < 1uSv/h
Ürün Açıklaması
High-definition FPD Detector BGA Head-In-Pillow Defect AX9500 Unicomp SMT Welding Analysis System The AX9500 UNICOMP X-Ray Computed Tomography System delivers high-precision CT inspection for accurate PCB and BGA analysis. This fully upgraded system performs comprehensive CT detection on BGA, CSP, flip chips, LEDs, and other semiconductors, plus SMT welding analysis with advanced 3D tomography CT scanning capabilities. Applications Semiconductor industry inspection SMT
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