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High‑definition FPD SMT BGA Packaging X‑ray Inspection Machine AX9500 Unicomp

Temel Özellikler
Menşe Yeri: Çin
Marka Adı: UNICOMP
Sertifikasyon: CE, FDA
Model Numarası: AX9500
Ticaret Mülkleri
Minimum Sipariş Miktarı: 1 takım
Fiyat: can negotiate
Ödeme Koşulları: T/T,L/C
Tedarik Yeteneği: Ayda 300 Takım
Ürün Özetleri
High-definition FPD SMT BGA Packaging X-ray Inspection Machine AX9500 Unicomp The AX9500 UNICOMP X-Ray Computed Tomography System delivers high-precision inspection capabilities for accurate PCB and BGA analysis. This fully upgraded system performs CT detection on BGA, CSP, flip chips, LEDs, and ...

Ürün Detayları

Vurgulamak:

FPD SMT X-ray inspection machine

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BGA packaging X-ray machine

,

Unicomp AX9500 X-ray inspection

Name: Unicomp X-ray Muayene Makinesi
Application: SMT, EMS, BGA, Elektronik, CSP, LED, Flip Chip, Yarı İletken
Industry: Elektronik endüstrisi
X-Ray Leakage: < 1uSv/h
Ürün Açıklaması
High-definition FPD SMT BGA Packaging X-ray Inspection Machine AX9500 Unicomp The AX9500 UNICOMP X-Ray Computed Tomography System delivers high-precision inspection capabilities for accurate PCB and BGA analysis. This fully upgraded system performs CT detection on BGA, CSP, flip chips, LEDs, and other semiconductors, while also supporting SMT welding analysis with advanced 3D tomography CT scanning technology (planar CT + cone beam CT). Applications Semiconductor industry SMT
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