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High Resolution For PCBA BGA Solder Quality Test X‑ray Equipment UNICOMP AX9100MAX SMT IC Inspection System

Temel Özellikler
Menşe Yeri: Çin
Marka Adı: UNICOMP
Sertifikasyon: CE, FDA
Model Numarası: AX9100max
Ticaret Mülkleri
Minimum Sipariş Miktarı: 1 takım
Fiyat: can negotiate
Ödeme Koşulları: L/C,T/T
Tedarik Yeteneği: Ayda 30 takım
Ürün Özetleri
UNICOMP AX9100MAX X-Ray Inspection System High-resolution X-ray equipment for PCBA BGA solder quality testing and SMT IC inspection with advanced non-destructive testing capabilities. System Overview This advanced X-ray inspection system is designed for high-precision non-destructive testing of ...

Ürün Detayları

Vurgulamak:

PCBA BGA solder test X-ray equipment

,

SMT IC inspection X-ray machine

,

high resolution X-ray equipment for PCBA

Machine Type: Yarı İletken Elektronik X-Ray İnceleme Sistemi
Model: AX9100max
X-Ray Tube Type: Mühürlü Tip
Pixel Size: 84μm
Pixel: 1536*1536
Footprint: 1450(G)×1765(D)×1835(Y)mm
Ürün Açıklaması
UNICOMP AX9100MAX X-Ray Inspection System High-resolution X-ray equipment for PCBA BGA solder quality testing and SMT IC inspection with advanced non-destructive testing capabilities. System Overview This advanced X-ray inspection system is designed for high-precision non-destructive testing of electronics IC components and bonding wire analysis. It is widely deployed across industrial and semiconductor applications for quality control and R&D verification. Applications BGA,
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