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IC BGA CSP QFN Packaging Inspection X-ray AX8300MAX UNICOMP 4K Flat Panel Detector

Temel Özellikler
Menşe Yeri: Çin
Marka Adı: UNICOMP
Sertifikasyon: CE, FDA
Model Numarası: AX8300MAX
Ticaret Mülkleri
Minimum Sipariş Miktarı: 1 takım
Fiyat: can negotiate
Ödeme Koşulları: T/T,L/C
Tedarik Yeteneği: Ayda 30 takım
Ürün Özetleri
AX8300MAX X-ray Inspection System Advanced industrial X-ray inspection system engineered for precision analysis of IGBT solder voiding and comprehensive quality verification of electronic components and industrial workpieces. Applications This inspection system is extensively deployed for quality ...

Ürün Detayları

Vurgulamak:

BGA packaging inspection X-ray machine

,

CSP X-ray detector with 4K resolution

,

QFN X-ray machine with flat panel

Model: AX8300MAX
Motion Control Mode: Fare ve Klavye ve Oyun Çubuğu
Tilt And Rotation: Dedektörün tek taraflı eğimi maksimum 60°
Monitor: 27" HD 4K ekran
System OS: Windows11 64 bit
Power Consumption: 900W
Tube Type: Kapalı
Ürün Açıklaması
AX8300MAX X-ray Inspection System Advanced industrial X-ray inspection system engineered for precision analysis of IGBT solder voiding and comprehensive quality verification of electronic components and industrial workpieces. Applications This inspection system is extensively deployed for quality verification of semiconductor packaging devices including BGA, CSP, LED and flip chip, automotive electronic components, new energy core parts, aluminum die castings, injection
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    United States Jan 21.2026
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