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Full 3D Inspection of BGA Bumps Unicomp AX9100vs Die & Internal Circuits

Temel Özellikler
Menşe Yeri: Çin
Marka Adı: Unicomp
Sertifikasyon: CE
Model Numarası: AX9100VS
Ticaret Mülkleri
Minimum Sipariş Miktarı: 1 adet
Fiyat: can negotiate
Ödeme Koşulları: T/T,L/C
Tedarik Yeteneği: Ayda 30 takım
Ürün Özetleri
Full 3D Inspection of BGA Bumps Unicomp AX9100vs Die & Internal Circuits Advanced X-ray inspection system designed for comprehensive semiconductor and PCBA production analysis with full-angle rotary capabilities. Applications BGA, CSP, LED, Flip Chip Automotive Components and New Energy Industry ...

Ürün Detayları

Vurgulamak:

BGA bumps X-ray inspection machine

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3D X-ray machine for internal circuits

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Unicomp AX9100vs die inspection machine

Name: Unicomp X-ray AX9100vs Çok modlu 3D Mikro odaklı X-ray analiz denetim sistemi
Footprint: 1400 (L) × 1720 (W) × 1800 (h) mm
Machine Weight: 2925 kg
Power: 4.5kw
Tube Type: Kapalı
Ürün Açıklaması
Full 3D Inspection of BGA Bumps Unicomp AX9100vs Die & Internal Circuits Advanced X-ray inspection system designed for comprehensive semiconductor and PCBA production analysis with full-angle rotary capabilities. Applications BGA, CSP, LED, Flip Chip Automotive Components and New Energy Industry Aluminum Die Casting, Molded Plastic Ceramic Products and other special industries Key Features Precise detection inspection of tiny defects Multi-mode 3D reconstruction Synchronized
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    United States Jan 21.2026
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