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Unicomp AX8300H X-ray Inspection Machine with 110kV Microfocus X-ray Source and High Resolution FPD

Temel Özellikler
Menşe Yeri: Çin
Marka Adı: UNICOMP
Sertifikasyon: CE, FDA
Model Numarası: AX8300H
Ticaret Mülkleri
Minimum Sipariş Miktarı: 1 TAKIM
Fiyat: can negotiate
Ödeme Koşulları: T/T,L/C
Tedarik Yeteneği: Ayda 300 takım
Ürün Özetleri
110kV mikrofokus kaynağı ve 360° dönüşlü AX8300H X-ışını denetimi. BGA, CSP, yarı iletken analizi için yüksek çözünürlüklü FPD tespiti. <1μSv/h sızıntıyla FDA güvenlik standartlarını karşılar.

Ürün Detayları

Vurgulamak:

110kV Microfocus X-ray Source X-ray Inspection Machine

,

360 Degree Rotating Table X-ray Detector

,

High Resolution FPD X-ray System

Name: X-ışını Muayene Makinesi
Application: SMT, EMS, BGA, Elektronik, CSP, LED, Flip Chip, Yarı İletken
Tube Voltage: 110kV
X-Ray Leakage: < 1uSv/h
Weight: 1605kg
Power Consumption: 1.2kw
Ürün Açıklaması
Unicomp X-Ray Detector AX8300H with 110kV Microfocus X-Ray Source and 360° Rotating Table
The AX-8300H X-ray Detector is engineered specifically for high-resolution PCBA inspection applications. This innovative system represents an industry first by utilizing a specialized 110kV microfocus x-ray source, providing the ideal energy solution when 90kV is insufficient and 130kV is excessive.
Featuring state-of-the-art Flat Panel Display (FPD) detection technology, the AX-8300H generates exceptionally high magnification and resolution images comparable to the finest 90kV x-ray tube systems. The 360° rotating table offers unlimited imaging perspectives for comprehensive inspection capabilities.
Key Features
  • 110kV Microfocus X-ray Source
  • High Resolution Flat Panel Detector (FPD)
  • X/Y/Z/Tilt Motions (table, tube, FPD)
  • 360° Table Rotation
  • Angle View up to 70 Degrees
  • Point and Click Location Navigation
  • CNC Programming for Multiple Image Inspection Routines
  • Maximum Inspection Area: 360 x 340mm
Applications
  • BGA/CSP/Flip Chip: Bridging, Voids, Opens, Excessive/Insufficient Solder
  • QFN: Bridging, Voids, Opens, Registration
  • SMT Standard Components: QFP, SOT, SOIC, Chips, Connectors, Others
  • Semiconductor: Bond Wire, Die Attach Void, Mold Void
  • Multi-layer Board (MLB): Inner Layer Registration, Pad Stack, Blind/Buried Vias
Technical Specifications
Model AX8300H
Max kV/Type 110 kV/Sealed
Max Electron Beam Power 25W
Focal Spot Size 5μm
System Magnification Up to 1000X
Imaging System (Option) Flat Panel Detector
Manipulator 8-axis with tilt 50 degree
Measuring Volume Max load area 300x300mm²
Max Sample Weight 5kg
Monitors 27" HD
Cabinet Dimensions 1200x1400x1700mm
Weight 1605kg
Radiation Safety <1μSv/hr (<0.1mR/hr) at the cabinet surface 5cm
Control Keyboard/Mouse/Joystick
Automated Inspection Standard
Primary Applications Chip inspection/Electronic components/Auto parts, etc.
Note: Focal spot size is variable. Please consult Unicomp for specific requirements. All x-ray machines manufactured by Unicomp Technology meet FDA-CDRH Regulation CFR 21 1020.40 Subchapter J for cabinet x-ray systems, with radiation emissions not exceeding 5 millirem/hr at 2" from any external surface.
Inspection Images
Unicomp AX8300H X-ray Inspection Machine with 110kV Microfocus X-ray Source and High Resolution FPD 0
Genel Değerlendirme
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Tüm Yorumlar
  • M
    Marek
    Hungary Feb 10.2026
    ★★★★★
    ★★★★★
    The machine is excellent, the service is satisfactory, and the technology is highly professional.
  • P
    Peter
    France Feb 20.2025
    ★★★★★
    ★★★★★
    good product
  • S
    Smith
    Germany May 16.2024
    ★★★★★
    ★★★★★
    Stable product quality , reliable cooperation partner
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