electronics x ray system
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Kablo Demeti için 5um Yüksek Çözünürlüklü 90KV Unicomp X Ray FPD Dedektörü
Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1.Large Size Inspection Table Laser Locator for Precise Location 2.24’’ FHD Interactive Touch LCD Display 3.Accurate Control, CNC Programming Automatic Positioning 4.FPD 60° Tilting Inspection 5.Fingerprint Access Management System 6
CNC Programlanabilir Muayene için Unicomp AX8200Max X Ray Makinesi 6 Eksen Manipülatörü
Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1.Large Size Inspection Table Laser Locator for Precise Location 2.24’’ FHD Interactive Touch LCD Display 3.Accurate Control, CNC Programming Automatic Positioning 4.FPD 60° Tilting Inspection 5.Fingerprint Access Management System 6
SMT BGA QFN Boşlukları için 5um 90kV X Ray Tarayıcı Makinesi Unicomp AX8200MAX
90kV 5um microfocus Xray machine Unicomp AX8200MAX for SMT BGA QFN voids measurement with automatic inspection Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24’’ FHD Interactive Touch LCD Display 3. Accurate
CE / FDA Sertifikalı Unicomp 110KV 5μm IC Kalitesini kontrol etmek için X Ray Kaynağı
CE/FDA Certificated Unicomp 110KV 5μm X Ray Source to check IC Quality Key Parameter: Max. Tube Voltage: 110kV Max. Tube Power: 25W Beam Angle: 110±3° Min. Spot Size: ≤5μm Beam Angle: 110±3° Applications: SMT, PCBA ,Electronic Manufacturing Integrated Circuit Package IGBT Substrate / Module EV Battery Specifications: Operating Tube Voltage Range 40-110 kV Operating Tube Current Range 0-250 μA Maximum Tube Power 25W Input Voltage (DC) 25±0.5V Power Consumption ＜75W Window
% 100 yerli hammaddedir. Unicomp mikro odaklı röntgen kaynağı.
100% Domestic Raw Material Unicomp Microfocus X Ray Source Key Parameter: Max. Tube Power: 25W Max. Tube Voltage: 110kV Beam Angle: 110±3° Beam Angle: 110±3° Min. Spot Size: ≤5μm Applications: Integrated Circuit Package SMT, PCBA ,Electronic Manufacturing EV Battery IGBT Substrate / Module Specifications: Operating Tube Voltage Range 40-110 kV Operating Tube Current Range 0-250 μA Maximum Tube Power 25W Input Voltage (DC) 25±0.5V Power Consumption ＜75W Window Material
Görüntü Süper çözünürlüklü yeniden yapılandırma algoritmaları ile AX9100max röntgen sistemi
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 3.5 kW X-Ray Tube Tube Type Type Sealed type Max.
SMT PCB X-ışını makinesi BGA boşlukları ölçümü ve lehim geçmiş tırmanış yüksekliği denetimi için mikron odak noktası boyutu
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Power Consumption 3.5 kW Packing Weight 2600 kg X-Ray Tube Tube Type Type Sealed type Max.
130KV Mikron Odak Noktası Boyutlu Tüp X-ışını Makinesi AX9100MAX PCB ve BGA Denetimi İçin Çift Bilgisayarla
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Power Consumption 3.5 kW Packing Weight 2600 kg X-Ray Tube Tube Type Type Sealed type Max.
IC Eğrilik Ölçümü Unicomp AX9100MAX 84μm piksel boyutu ve 60° eğilim açısı olan X-Ray Makinesi
It is widely utilized in applications such as BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Modules, Cables, Photovoltaic Industry, and more. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)×1760(D)×1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 4 kW X-Ray
