logo
Hoş geldiniz. Unicomp Technology
+86-13502802495
KURMAK 90 için ürünler "

electronic inspection equipment

"
Kalite EMS Semiconductor Unicomp X Ray İnceleme Makinesi Elektroniği BGA AX8200 fabrika

EMS Semiconductor Unicomp X Ray İnceleme Makinesi Elektroniği BGA AX8200

EMS Semiconductor Unicomp X-Ray Inspection System Electronics BGA AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, ...

Kalite Elektronik SMT Kabini Unicomp X-Ray İnceleme Sistemi AX8500 Hata Analizi fabrika

Elektronik SMT Kabini Unicomp X-Ray İnceleme Sistemi AX8500 Hata Analizi

Electronics SMT Cabinet Unicomp X-Ray Inspection System AX8500 Failure Analysis Features: ● 100KV 5μm X-Ray tube. ● FPD Detector. ● Real-time image. ● 1000X system magnification. ● 6 axis linkage system. ● X-ray tube and FPD simultaneously tilt ±35°. ● Modular design with In-line expansibility. ● ...

Kalite AX7900 IC LED Klipler X-ray İnceleme Makinesi, Dijital Elektronik X-Ray Makinesi fabrika

AX7900 IC LED Klipler X-ray İnceleme Makinesi, Dijital Elektronik X-Ray Makinesi

AX7900 IC LED Clips X-ray Inspection Machine Electronic Components Detector Description: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. ...

Kalite Yarıiletken Gofret Yüzeylerinde Arıza Tespiti İçin Elektronik Unikom X-Işını Makinesi fabrika

Yarıiletken Gofret Yüzeylerinde Arıza Tespiti İçin Elektronik Unikom X-Işını Makinesi

EMS Semiconductor Unicomp PCB X Ray Machine for Electronics BGA AX8200​ X-ray inspection system has been widely applied to Circuit Board Inspection,Semi-Conductor Inspection and Other Applications. (Offline X - Ray series) widely used in offline detection, defect analysis, used for PCBA, packaging, ...

Kalite LCD Ekran 1.0kW X Ray İnceleme Makinesi Unicomp AX8200 BGA İnceleme fabrika

LCD Ekran 1.0kW X Ray İnceleme Makinesi Unicomp AX8200 BGA İnceleme

SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes ...

Kalite 220VAC CNC Programlanabilir Elektronik X Ray Makinesi 5um 90kV AX8200 fabrika

220VAC CNC Programlanabilir Elektronik X Ray Makinesi 5um 90kV AX8200

SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200 Applications BGA Inspection Inspection of over molded electrical connectors Encapsulated components Aluminum die castings Molded plastic components Ceramics Aerospace components Electrical / mechanical components Electronic ...

Kalite BGA QFN Lehimleme için Inline SPC Elektronik X Ray Makinesi LX2000 FPC Analizi fabrika

BGA QFN Lehimleme için Inline SPC Elektronik X Ray Makinesi LX2000 FPC Analizi

Fully automatic Inspection and Analysing Inline AXI LX2000 X-ray for BGA , QFN soldering void inspection one FPC Technical Parameters and Specifications System Summary Footprint 2595(W)×1392(D)×1992(H)mm Machine Weight 1900 kg (X-Ray) / 700kg (Conveyor) Power Supply AC 110~220V, 50/60Hz Plywood ...

Kalite Semicon IC Yongaları için HD FPD Elektronik X Ray Makinesi 0.8kW fabrika

Semicon IC Yongaları için HD FPD Elektronik X Ray Makinesi 0.8kW

HD FPD Electronics X Ray Machine 0.8kW For Semicon IC Chips Microfocus X Ray machine with HD FPD for semicon IC chips wire sweep broken defect Inspection Specifications of Xray machine: System Summary Footprint 1215(W)×1325(D)×1700(H)mm Machine Weight 1240 kg Power Supply AC 220V, 50/60Hz Plywood ...

Kalite AX9100 130kV Elektronik Yarı İletken Tel Yapıştırma Süpürme Muayenesi için X Ray Makinesi fabrika

AX9100 130kV Elektronik Yarı İletken Tel Yapıştırma Süpürme Muayenesi için X Ray Makinesi

High Resolution of 130kV AX9100 X-ray for Semiconductor wire bonding sweep inspection Technical Data Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight 1900kg Power 220AC/50Hz Power Consumption 1.6kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W Spot Size 7μm X...