bga x ray machine
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Otomotiv Elektroniği için Kapalı Tüp Unicomp X Ray AX8200 Max 5μM
Using Unicomp AX8200Max close tube Microfocus X-ray to detect Automotive electronics inner quality defects Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24’’ FHD Interactive Touch LCD Display 3. Accurate Control,
Kablo Demeti için 5um Yüksek Çözünürlüklü 90KV Unicomp X Ray FPD Dedektörü
Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1.Large Size Inspection Table Laser Locator for Precise Location 2.24’’ FHD Interactive Touch LCD Display 3.Accurate Control, CNC Programming Automatic Positioning 4.FPD 60° Tilting Inspection 5.Fingerprint Access Management System 6
China Unicomp 90KV X-ray ile Yonga Seti Kusurlarının Tespiti için HD PFD İnceleme Sistemi
China Unicomp 90KV X-ray with HD PFD Inspection System for Chipset Defects Detecting Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24’’ FHD Interactive Touch LCD Display 3. Accurate Control, CNC Programming
CNC Modu ve X-ışını Sızıntı 1uSv / h ile Endüstri Standart LED X-ışını Denetim Makinesi
Application It's mainly used in light strip backlight detection, LED bubble detection, TV backlight LED strip detection; It can also be applied to BGA, CSP, Flip ceramic element, chip electronic inspection, products.Aerospace connector semiconductor, module components, package testing, photovoltaic industry, battery industry, etc. Features Sµm closed X-Ray tube, HD digital flat panel X-Ray tube & Detector motion up and down, friendly user interface and fast target point
LED Lehimleme için 100kV 1uSv / h X Ray Algılama Makinesi 1.0KW
Application It's mainly used in light strip backlight detection, LED bubble detection, TV backlight LED strip detection; It can also be applied to BGA, CSP, Flip ceramic element, chip electronic inspection, products.Aerospace connector semiconductor, module components, package testing, photovoltaic industry, battery industry, etc. Features Sµm closed X-Ray tube, HD digital flat panel X-Ray tube & Detector motion up and down, friendly user interface and fast target point
LED Aydınlatma için 1kW 1uSv / H 90KV X Ray Tarama Makinesi
Application It's mainly used in light strip backlight detection, LED bubble detection, TV backlight LED strip detection; It can also be applied to BGA, CSP, Flip ceramic element, chip electronic inspection, products.Aerospace connector semiconductor, module components, package testing, photovoltaic industry, battery industry, etc. Features Sµm closed X-Ray tube, HD digital flat panel Max. loading area 1300 x 650mm, Max. inspection area 1300 x 700mm ;600x Magnification
1.2m LED Işıklar için 130kV 5μm X Ray Muayene Ekipmanı
Application It's mainly used in light strip backlight detection, LED bubble detection, TV backlight LED strip detection; It can also be applied to BGA, CSP, Flip ceramic element, chip electronic inspection, products.Aerospace connector semiconductor, module components, package testing, photovoltaic industry, battery industry, etc. Features Sµm closed X-Ray tube, HD digital flat panel Max. loading area 1300 x 650mm, Max. inspection area 1300 x 700mm ;600x Magnification
LED Lehimleme 1kW 90KV X Ray Algılama Ekipmanı 24 ''
Application It's mainly used in light strip backlight detection, LED bubble detection, TV backlight LED strip detection; It can also be applied to BGA, CSP, Flip ceramic element, chip electronic inspection, products.Aerospace connector semiconductor, module components, package testing, photovoltaic industry, battery industry, etc. Features Sµm closed X-Ray tube, HD digital flat panel Max. loading area 1300 x 650mm, Max. inspection area 1300 x 700mm ;600x Magnification
Elektronik Bileşenlerin iç kusurlarını incelemek için Unicomp AX9100max X-ışını sistemi
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 3.5 kW X-Ray Tube Tube Type Type Sealed type Max.
