bga x ray inspection system
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FPD Unicomp AX8200B Çevrimdışı X Ray Makinesi Li İyon Hücresi için 100kv
Smt X-ray Closed 5g Chipset Electronic Connector Module Inspection Machine AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the
CSP Lityum Pil X Ray Tarayıcı Makinesi Unicomp Çevrimdışı Model AX8200B
Smt X-ray Closed 5g Chipset Electronic Connector Module Inspection Machine AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the
Unicomp AX8200 Elektronik Röntgen Makinesi Kapalı Tüp Kablo Demeti Konnektörleri
Cable Harness Connectors Quality Inspection by Unicomp AX8200 Microfocs X-ray with high resolution FPD Applications: BGA , CSP , LED , Flip Chip , Semiconductor, Battery Industry , Small Metal Casting, Electronic Connector Module, Aerospace Components , Photovoltaic Industry, The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing
Otomotiv Elektroniği Modülleri için Kapalı Tüp SMT X Ray Ekipmanı AX8200 8W
Applying 5micro closed tube AX8200 X-ray for Automotive Electronics Modules quality defects control Other Special Industries. Item Definition Specs System Parameters Size 1080(L)X1180(W)X1730(H)mm Weight 1150kg Power 220AC/50HZ Power Consumption 0.8KW X-Ray Tube Type Closed Max.Voltage 90kv/100kv Max.Power 8W Spot Size 5μm X-Ray System Intensifier 4"Image Intensifier Monitor 22"LCD System Magnification 600X Detection Region Max.Loading Size 510mm x 420mm Max.Inspection Area
SMT BGA Muayene X Ray Chip Sayacı 440mm Tünel CE
Features ● Automatic inspection, no need on programs switch for different components ● Fast speed and high accurate chip counting, reducing labor costs ● No chip damage or lost with non-destructive counting ● Compatible with 7”~17” tape & reels ● Automatic link with ERP & MES System, and storage system ● Shielded cabinet protection to guarantee Safety leakage of X-ray ● Fast counting Speed:12~13s/Reel ● Inspection Accuracy: ≥99.9% ● Min. Package: 01005 ● One-button operation,
EMS SMT PCBA QFP için Unicomp AX8200max FPD Dedektörü X Ray Makinesi
CHINA Leading X-ray manufacturer Unicomp AX8200max machine for EMS SMT PCBA QFP IC SOT package reflow Soldering Void Inspection Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1.Large Size Inspection Table Laser Locator for Precise Location 2.24’’ FHD Interactive Touch LCD Display 3
Kablo Demeti için 5um Yüksek Çözünürlüklü 90KV Unicomp X Ray FPD Dedektörü
Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1.Large Size Inspection Table Laser Locator for Precise Location 2.24’’ FHD Interactive Touch LCD Display 3.Accurate Control, CNC Programming Automatic Positioning 4.FPD 60° Tilting Inspection 5.Fingerprint Access Management System 6
Yüksek Spesifikasyonlu Elektronik Taşlar 2D ve 2.5D X-Ray Makinesi Unicomp AX9100MAX 360 Derece Dönüş Masası ile BGA ve PCB Denetimi İçin
It enjoys broad utilization across diverse domains including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Manufacturing, Small-scale Metal Casting, Electronic Connector Modules, Cables, and the Photovoltaic Industry, among others. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)×1760(D)×1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight
FPD Dedektörü 1kW 90KV EMS Muayene X Ray Ekipmanı
Application BGA , CSP , Flip Chip, LED , Fuse, Diode, PCB Semiconductor , Battery Industry , Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry Features • 90kV 5µm closed X-ray tube, digital flat panel with 2 mega pixels CCD camera • Multi-function DXI image processing system, CNC programmable detection • Max. loading area 500mm*450mm, max. inspection area 500mm*450mm, with 600X Magnification • Multi-function workstation with
