Microfocus X Ray
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IGBT Kusur Kontrolü Mikrofokus X ışını kaynağı X ışını algılama makinesine monte edilmiş
Chinese Factory X Ray Source for X Ray Inspection Machine to check IGBT Key Parameter: Max. Tube Power: 60W Max. Tube Voltage: 150kV Beam Angle: 110±3° Min. Spot Size: ≤7μm Applications: Integrated Circuit Package EV Battery SMT, PCBA ,Electronic Manufacturing IGBT Substrate / Module Specifications: Operating Tube Voltage Range 40-150 kV Operating Tube Current Range 0-400 μA Maximum Tube Power 60W Power Consumption ＜150W Input Voltage (DC) 48±0.5V Window Material/Thickness Be
Microfocus X Ray İnceleme Makinesi Lityum Pil İçin Tüp 5KW Kapat
Cabinet Lithium Battery Automatic X-ray Inspection Machine AX8800 Applications: ●Lithium battery pole piece solder joint defect detection, ●Lithium battery batteries coiling case detection, ●BGA , CSP , LED , Flip Chip , Semiconductor, ●Battery Industry , Small Metal Casting, ●Electronic Connector Module, ●Aerospace Components , Photovoltaic Industry , ●Other Special Industries. Aftersales service: Ø A professional service team Ø Country-wide network Ø 24/7 hotline Ø Onsite
Gıda Endüstrisi için Microfocus X-Ray Denetim Sistemi
UNX4015N X-Ray system for ham sausage/jerky/nuts foreign matters inspection Application UNX4015-N is used to detect foreign matter contaminants in small bags for lightweights products. Such as candy, fresh meat, prawn, vegetable, poultry, chocolates, candy, pasta, instant noodles, bread, biscuits, dried fish, ham sausage, beef jerky, nuts, etc. Specificaitions Equipment Features Dimension 1168(W)X985(D)X1510(H)mm Machine weight 500kg X-ray tube 80-120kv/210-480W Power Supply
PCBA BGA lehimleme boşluğu kontrolü için yüksek çözünürlüklü FPD'li 90KV 5um mikrofokus X-ray sistemi
90KV 5um microfocus X-ray system with high resolution FPD for PCBA BGA soldering void checking Specifications of SMT Xray machine: System Summary Footprint 1200(W)×1200(D)×1500(H)mm Machine Weight 1130 kg Power Supply AC 110/220V, 50/60Hz Plywood Packing Size 1350(W)×1350(D)×1800(H)mm Packing Weight 1330 kg Power Consumption 1.3kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD) Pixel
SMT PCBA BGA lehimleme Muayenesi için Unicomp AX9100'ün 130kV mikrofokus X-ışını
130kV microfocus X-ray of Unicomp AX9100 for SMT PCBA BGA soldering Inspection Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery
Çevrimdışı 5um mikrofokus X-ray makinesi AX8200B Lityum Pil hücre bobini sarma yanlış hizalama denetimi için
Offline 5um microfocus X-ray machine AX8200B for Lithium Battery cell coil winding misalighment inspection The lithium battery X-Ray detection equipment of multiple types and full automation solely-developed by Unicomp Technology is targetted to inspect cells alignment metric and tabs soldering quality . It improves automation as well as gains high-definition internal images by means of X-ray imaging technology . This technology is widely applied to the detection of lithium
TWS Lityum Düğme Hücre Kalite Kontrolü için Unicomp mikrofokus X Ray Makinesi
Unicomp microfocus X Ray Machine for TWS Lithium Button Cell Quality Check Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery
PCBA BGA QFN LED lehimleme boşluğunu incelemek için FPD 55° eğimli görünüme sahip 5μm Mikrofokus X-ray
5μm Microfocus X-ray with FPD 55° tilting view to inspect PCBA BGA QFN LED soldering void Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD) Pixel
SMT BGA Lehimleme Boşluk Ölçümü X-Ray Makinesi Microfocus 130kV
130kV 7 μm Microfovus X-Ray Machine For SMT BGA Soldering Void Measurement Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● Aluminum Die-casting, Moulding Plastic. ● Ceramics, Other Special Industries. Features: ● 1000X magnification, high-definition real-time image. ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● One
